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Date :- May 12, 2025
January 27, 2025 — In a major strategic move towards revolutionizing global communication infrastructure, the SRAM & MRAM Group UK today signed a Memorandum of Understanding (MOU) with Taiwan DCOE Integrated Optical Communications, a pioneering Taiwanese company led by third-generation semiconductor scientists and seasoned industry experts.
The agreement marks a significant milestone in collaborative technology development, focusing on the manufacture of all-optical chips for 5G and future 6G communications, as well as the "optical chip small base station" industry chain—crucial for powering the Internet of Everything (IoE) and advanced defense systems.
Under the MOU, both parties will also collaborate to establish semiconductor wafer fabs specializing in 7nm to 14nm technologies, further enhancing production capabilities in high-speed data transmission, smart city solutions, and military-grade radar systems.
These next-generation optical chip small base stations, capable of transmission speeds between 200Gbps and 800Gbps, are set to transform communication infrastructures globally by enabling faster, more efficient, and integrated connectivity across devices and industries.
Manufacturing hubs will be established in Singapore and India, reflecting the SRAM & MRAM Group’s commitment to global innovation, technological excellence, and regional economic development.
The MOU was formally signed today by Mr. NVR Suresh, Executive Director of SRAM & MRAM Group UK, and Mr. Michael Chou, Executive Director of DC Communication of OptoElectronics Limited, in a ceremony that underscores the shared vision of both organizations in leading the future of optical communication technologies.
This partnership is poised to play a transformative role in reshaping global semiconductor and communication ecosystems, reinforcing SRAM & MRAM Group’s role as a leader in future-focused technology initiatives.
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Read More